•fr4 copper clad laminated consists of E-glass fabric impregnated with epoxy resin and clad withcopper foil.To get more news about fr4 circuit board, you can visit pcbmake official website.

Specifications: CCL-FR4 consists of E-glass fabric, impregnated with epoxy resin and clad with electrolytic foil 0.6mm,0.8mm,1.0mm,1.2mm,1.5mm,1.6mm.

Characteristic and Application: FR4 Copper Clad Laminate/CCL consists of E-glass fabric, impregnated with epoxy resin and clad with electrolytic foil. It has excellent electric, mechanical and flamer retardant properties and is widely used for PWB with printed circuit on single or double side in microwave ovens, computers, computers, communication apparatus as well as other high grade electronic instruments.
•It has excellent mechanical property, dimensional stability, stronger impact resistance

The characteristics of FR4 or FR-4 make it very versatile and affordable. This is why it is widely used in printed circuit production. FR4 tg130 is the most commonly used material for fr4 circuit boards. FR4 describes a class of flame retardant glass fiber epoxy laminates.

The reasonable price of FR4 makes it a standard choice for small batch PCB production or electronic prototype production.

However, FR4 is not ideal for high frequency printed circuits. Similarly, if you want to make a PCB into a product that is not easy to use components and hardly suitable for flexible PCBs, you should choose another material: polyimide / polyamide.
Standard FR4: as the name suggests, this is the standard FR-4 with a heat resistance of about 140 ° C to 150 ° C.
High Tg FR4: This FR-4 has a high glass transition (TG) of about 180 ° C.
High CTI FR4: the comparison tracking index is higher than 600 v.
FR4 without copper laminate: ideal for insulation and plate support.
The characteristics of these different materials are described in detail later in this paper.